KOMI Global

Provides engineered bonding
solutions to the electronics industry

KOMI has over 1,000 machines installed around the world

KOMI Global

Provides engineered bonding
solutions to the electronics industry

KOMI has over 1,000 machines installed around the world

KOMI Global Applications

  • Mobile Phones Solutions for prebonding PSA, heat activated/cured & other types of adhesive diecuts and bonding. Machines & fixture options for various design platforms.
  • Laptops & Tablets Accurate & precise PSA diecuts alignment to Housings/Frames for prebonding. Machines & fixture designs to achieve uniform pressure distribution for optimum adhesive wetting.
  • Wearable Devices Solutions for prebonding PSA, heat activated/cured & other types of adhesive diecuts and bonding. Efficient design for small machine footprint for cleanroom uses.